TY - JOUR
T1 - Copper Alloy-Impregnated Carbon-Carbon Hybrid Composites for Electronic Packaging Applications
AU - Datta, S. K.
AU - Gatica, Jorge E.
AU - Shih, W.
AU - Bentsen, L.
N1 - Datta, S.K., Tewari, S.N, Gatica, J.E., Shih, W., & Bentsen, L. (1999). Copper Alloy-Impregnated Carbon-Carbon Hybrid Composites for Electronic Packaging Applications. Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science 30, 175-181.
PY - 1999/1/1
Y1 - 1999/1/1
N2 - Porous carbon-carbon preforms, based on three-dimensional networks of PAN (Polyacrylonitrile)-based carbon fibers and various volume fractions of chemical vapor-deposited (CVD) carbon, were impregnated by oxygen-free, high-conductivity (OFHC) Cu, Cu-6Si-0.9Cr, and Cu-0.3Si-0.3Cr (wt pct) alloys by pressure infiltration casting. The obtained composites were characterized for their coefficient of thermal expansion (CTE) and thermal conductivity (K) along the through-thickness and two in-plane directions. One composite, with a 28 vol pct Cu-0.3Si-0.3Cr alloy, showed outstanding potential for thermal management applications in electronic applications. This composite exhibited approximately isotropic thermal expansion properties (CTE = 4 to 6.5 ppm/K) and thermal conductivities (k greater than or equal to 260 W/m K).
AB - Porous carbon-carbon preforms, based on three-dimensional networks of PAN (Polyacrylonitrile)-based carbon fibers and various volume fractions of chemical vapor-deposited (CVD) carbon, were impregnated by oxygen-free, high-conductivity (OFHC) Cu, Cu-6Si-0.9Cr, and Cu-0.3Si-0.3Cr (wt pct) alloys by pressure infiltration casting. The obtained composites were characterized for their coefficient of thermal expansion (CTE) and thermal conductivity (K) along the through-thickness and two in-plane directions. One composite, with a 28 vol pct Cu-0.3Si-0.3Cr alloy, showed outstanding potential for thermal management applications in electronic applications. This composite exhibited approximately isotropic thermal expansion properties (CTE = 4 to 6.5 ppm/K) and thermal conductivities (k greater than or equal to 260 W/m K).
UR - https://engagedscholarship.csuohio.edu/encbe_facpub/6
U2 - 10.1007/s11661-999-0205-7
DO - 10.1007/s11661-999-0205-7
M3 - Article
VL - 30
JO - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
JF - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
ER -